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2024 Taiwan Talent Recruiting Event to USA 10/6-13 - Visit & Career Talk-Santa Clara University - Company
No Company Name
(Industry Category)
Job Openings
(To see job details, please log in as a talent member.)
How to apply Click or Scan the "QR Code" to Upload Your Resume
No:1 Company Name:ITRI,Industrial Technology Research Institute
(Others)
Job Openings
(To see job details, please log in as a talent member.):
1.MMSL_Electrical control engineer(C300)
2.MMSL_Mechanical Engineer(C300)
3.MMSL_Self-driving car software R&D engineer(D300)
4.MMSL_Autonomous Vehicle Researcher (D300)
5.MMSL_ Autonomous vehicles (AV) Mapping team Engineer(D300)
6.MMSL_ Autonomous vehicles (AV) perception system engineer(D300)
7.MMSL_ Autonomous vehicles (AV)Simulation Verification Engineer(D300)
8.MMSL_Software Engineer(D400)
9.MMSL_Embedded system development engineer(D400)
10.MMSL_Automotive Controller Software Functional Safety Engineer(D400)
11.MMSL_Robotics & Machine Learning Engineer (Q500)
12.MMSL_Robotic Systems Engineer(Q200)
13.ICL_Deep Learning Engineer(K1)
14.ICL_AI Application Engineer(T101) 
15.ICL_Computer Vision and Generative AI Engineer (T2)
16.ICL_Generative AI (Text) Project Manager (T3)
17.ICL_Automotive Software Engineer(U103)
18.ICL_Telecom/Communication Embedded System Engineer (V502)
19.ICL_2D and 3D Generative AI Research Engineer (W102)
20.ICL_AI Application Security and Reliability Research Engineer (W202)
21.ICL_AI Testing Platform Development Engineering(W203)
22.ICL_GAI Research Engineer(W3)
23.Micro Electro Mechanical Systems (MEMS) Engineer(K200)
24.Senior Engineer- Power Electronics(N400)
25.Software System Engineer(S200)
26.3D imaging process engineer(J200/J300)
27.Optical System Engineer(E100/W300)
28.GEL_ Industrial Energy Conservation Researcher / Engineer (G300)
29.GEL_Information System Developer (U300)
30.GEL_Power Electronics Engineer (J300)
31.Microfluidic Biochip Engineer(BDL)
32.Hardware Design Engineer(BDL)
33.Senior Research Scientist in Diagnostics and Precision Medicine Technology(BDL)
34.BDL_ Pharmaceutical Researcher
35.BDL_ Senior Research Scientist in Regeneration Medicine
36.BDL_Cell Therapy Specialist
37.BDL_ Device Engineering
38.SSTC_ Strategy and Technology Expert (650A000)
39.SSTC_Technical Lead for Smart supply chain and logistic Technology (650U000)
40.IS_Laser Electrical and Control Technology Engineer (L300)
41. CMS_Mechanical Metrology Engineer (G700)
42.CMS_Photovoltaic System Engineer(H200)
43.CMS_Medical device evluation engineer(P000)
44.SSS_Integrated system of advanced optical sensing technology Engineer (L200)
45.MCL_Chemical Engineer
46.MCL_Artificial Intelligence Researcher
47.MCL_TEM Doctoral Researcher
48.MCL_Material Integrity Technology Engineer
49.MCL_Energy Storage Materials & Technology Researcher
50.MCL_Organic Opto-electronic Materials and Applications Researcher
51.ICRC_Senior Designer
52.IMTC_Software Development Engineer(0D200)
53.AI Industry Analyst
54.International Business Specialist
55.Semiconductor Industry Analyst
56.AI Application Development Intern (S100)
57.Embedded Systems Application Development Intern (T100)
58.Systems Engineering Information Systems Intern
59.Satellite Communication System Testing Intern
60.SDR Operation Intern
61.Autonomous Driving Intern(D300)
62.Vehicle Software Intern(D400)
63.Internship in the Development and Maintenance of Power Monitoring Interfaces(D500)
64.Institutional Design Intern(K300)
65.Circuit Design Intern(K300)
66.Service Robot AI Intern(Q200)
67.Machine Vision Intern(Q500)
68.Bioinformatics intern
69.Machine Vision Integration Intern (0H300)
70.Project Intern (0H500)
71.Web Database Maintenance and User Interface Development Intern(0D100)
Interview on-site
No:2 Company Name:NVIDIA
(Semiconductor)
Job Openings
(To see job details, please log in as a talent member.):
1.Senior Signal and Power Integrity Engineer
2.Senior Mixed Signal Design Engineer
3.Senior Memory Engineer
4.Senior Tool and Methodology Development Software Engineer
5.Senior Design Verification Engineer - PCIE
6.AI Computing Software Development Engineer, TensorRT
7.Senior Developer Technology Engineer - HPC
8.Senior BMC Firmware Developer
9.System Software Engineer
10.Senior Software QA Test Development Engineer
11.AI Algorithm Software Engineer
12.Senior AI System Software Engineer
13.Senior Generalist Software Engineer -- Omniverse
14.Senior Fullstack Software Engineer, CI/CD -- Omniverse
15.Senior Research Scientist, Circuits
16.Research Scientist - Design Automation
17.Research Scientist, Deep Learning and Computer Vision
18.Solutions Architect, LLM
19.Senior HPC Engineer, Professional Services
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No:3 Company Name:LITEON Technology
(Electrical & Electronic Components)
Job Openings
(To see job details, please log in as a talent member.):
1.Electrical Engineer
2.5G Firmware Engineer
3.Embedded Systems Engineer
4.IoT (Internet of Things) Engineer
5.Growth Product Strategist (EV)
6.Product Marketing Manager
7.Information Systems Intern
8.Technology Champion Trainee
9.Transformation Strategy Analyst
10.Strategic M&A Analyst
11.Smart Life Application Intern
12.Smart City Intern
13.Marketing Intern
14.Talent Ambassador Intern
15.Global Manufacturing Strategy Planning Senior Engineer
16.Chip Technology Research and Development Manager
17.BI Model Data Analyst
18.Automotive Computer Vision and Machine Learning Application Software Engineer
19.Liquid Cooling Systems Engineer
20.Electromagnetic Wave and High-Speed Signal Design Engineer
Interview on-site
No:4 Company Name:Delta Electronics, Inc.
(Electrical & Electronic Components)
Job Openings
(To see job details, please log in as a talent member.):
1.國際人才儲備幹部Global Management Associate
2.全球智慧製造技術工程師 Global Smart Manufacturing Technical Engineer
3.Member of R&D Staff
4.R&D Engineer RF Generator
5.Power Electronics EMI/EMC Engineer
6.Senior Engineer
7.Senior Lead-FW
8.Field Application Engineer
9.Electrical Engineer
10.Software Engineer
11.Automation Engineer
12.Testing Engineer
13.SMT Engineer
14.Field Application Engineer
15.Finance Process Automation Specialist
16.Field Application Engineer
17.Project Manager
18.SCM Senior Specialist
19.Software Engineer
20.Industrial Engineer
21.Mechnical Engineer
22.Electrical Engineer
23.Automation Engineer
24.Testing Engineer
25.Quality Engineer
Interview on-site
No:5 Company Name:Micron
(Semiconductor)
Job Openings
(To see job details, please log in as a talent member.):
1.2024 美光校園徵才專區 (正職/預聘) Micron Campus Hiring(歡迎社會新鮮人、應屆畢業生投遞)
2.【2024 New College Grads】IT Software Engineer – Engineering and Technology Development
3.IT DATABASE ADMINISTRATOR 資料庫管理師(DBA)
4.IT Host Automation Engineer (全球晶圓廠產線自動化)
5.WAREHOUSE PROFESSIONAL
6.[R&D] Engineer - DEG PE Design Readiness
7.Facilities Electrical Engineer
8.Industrial Safety Engineer
9.MTB PWF PHOTO EQUIPMENT ENGINEER (黃光設備工程師)
10.MTB PWF MRDA APPLICATION ENGINEER
11.TEST SOLUTIONS ENGINEER
12.Global Supply Chain - Tactical Planner
13.[PI] Process Integration Engineer 製程整合工程師 (台中)
14.[PI] Process Integration Engineer 製程整合工程師 (桃園)
15.[R&D] ASIC Design Engineer
16.【台中后里】Process Engineer 製程工程師(歡迎新鮮人/應屆畢業生)
17.【臺中后里區】F16/TCP Probe Equipment Engineer 歡迎新鮮人應徵
18.SMAI_【2024校園徵才】Data Engineer, Smart MFG & AI 資料工程師 (桃園/台中)
19.I4.0 ANALYST - SMART MFG & AI, YIELD 工業4.0分析師 (良率/製程整合)
20.I4.0 ANALYST, SMART MFG & AI, QUALITY 工業4.0分析師 (品質工程)
21.I4.0 ANALYST - Planning & Operation 工業4.0分析師 (生產製造)
22.【Micron 台南廠區】Micron 廠務擴建&EHS人才擴大招募
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No:6 Company Name:Taiwan Semiconductor Manufacturing Company
(Semiconductor)
Job Openings
(To see job details, please log in as a talent member.):
1.R&D Engineer
2.Design & Technology Platform Engineer
3.Integrated Interconnect & Packaging Engineer
4.Pathfinding for System Integration Engineer
5.Process Integration Engineers
6.Process Engineers
7.Equipment Engineer
8.Intelligent Manufacturing Engineer
9.Facility Engineers
10.Advanced Packaging Technology and Service Engineer
11.IT Software Engineers
12.DevOps Engineers
13.Data Engineer
14.Corporate Planning Operations
15.HR
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No:7 Company Name:ADLINK Technology Inc
(ICT)
Job Openings
(To see job details, please log in as a talent member.):
Coming Soon
Interview on-site
No:8 Company Name:Etron Technology, Inc.
(Semiconductor)
Job Openings
(To see job details, please log in as a talent member.):
Coming Soon
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No:9 Company Name:Mean Well USA Inc.
(Electrical & Electronic Components)
Job Openings
(To see job details, please log in as a talent member.):
1.產品專員
2.技服工程師
3.業務駐地代表(派駐紐澳)
4.Regional Sales Manager- Southern California
5.Regional Sales Manager- Midwest
6.IT Specialist
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No:10 Company Name:Taishin International Bank
(Financial Services)
Job Openings
(To see job details, please log in as a talent member.):
1.〔法金〕海外事業處ARM (台北)
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No:11 Company Name:ASUSTEK COMPUTER INC.
(Electrical & Electronic Components)
Job Openings
(To see job details, please log in as a talent member.):
1.RD20474 DevOps Engineer (開發維運工程師)
2.RD20495 Data Infrastructure Engineer (資料科學架構師)
3.RD20155 Senior Software Engineer (資深軟體工程師)
4.RD20156 SLAM Engineer (機器人 SLAM 工程師)
5.RD20158 Knowledge Engineer (知識工程師)
6.RD20159 Machine Learning Scientist (機器學習科學家)
7.RD20160 CloudOps Engineer (雲端維運工程師)
8.RD20161 Information Modeling Engineer (資訊模型工程師)
9.RD20162 Front-end Developer (前端網頁研發工程師)
10.RD20163 Data Scientist (資料科學家)
11.RD20164 Senior Industrial Control Specialist (資深工業控制工程師)
12.RD20165 Senior Data Infrastructure Engineer (資深資料架構工程師)
13.RD20166 Senior DevOps Engineer (資深開發維運工程師)
14.RD20167 Senior Machine Learning Scientist (資深機器學習科學家)
15.RD20168 Senior CloudOps Engineer (資深雲端維運工程師)
16.RD20169 Senior Data Architect (資深資料架構師)
17.RD20170 Senior Front-end Developer (資深前端網頁研發工程師)
18.RD20171 Senior Data Scientist (資深資料科學家)
19.RD20157 Robotics Software Development Engineer (機器人軟體研發工程師)
20.RD21549 Hardware Engineer (Commercial Product)
21.Signal Integrity & Power Integrity Engineer
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No:12 Company Name:QUANTA COMPUTER INC.
(Electrical & Electronic Components)
Job Openings
(To see job details, please log in as a talent member.):
1.雲端伺服器系統軟韌體工程(美國) - J2139
2.雲端伺服器硬體設計(美國) - J2219
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No:13 Company Name:Jeme Technology Co.,Ltd.
(Semiconductor)
Job Openings
(To see job details, please log in as a talent member.):
1.業務/Sales
2.類比/混訊IC設計工程師/Analog/Mix-signal IC Design Engineer
3.數位IC設計工程師/Digital IC Design Engineer
4.韌體工程師/Firmware Engineer
5.應用工程師/Field Application Engineer
Interview on-site